IPC has recently announced that Rob Rowland, Director of Engineering Operations at Axiom Electronics, has volunteered to serve as the chair for the IPC 5-21F Ball Grid Array Task Group and the IPC 5-22H Thermal Profiling Guide Task Group.
The 5-21F task group is responsible for the maintenance and further development of IPC-7095, Design and Assembly Process Implementation for BGAs. This document covers the characteristics for all elements of developing a cohesive product that uses BGA packages as components in electronic assembly.
The 5-22H task group is responsible for the management of IPC-7530, Temperature Profiling for Mass Soldering Processes (Reflow and Wave). This standard describes thermal profile guidelines and practical guidelines to meet requirements to produce acceptable solder joints in mass soldering processes.
Axiom Electronics applauds Rob’s willingness to chair these critical standards groups. Industry involvement is key to ensuring that standards align with evolving technology requirements.
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